Led package with metal pcb

ABSTRACT

The present invention relates to a light emitting diode (LED) package. An object of the present invention is to provide an LED package having a metal PCB, which has a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipments, and is compatible with an electronic device or illumination device currently used widely. To this end, an LED package according to the present invention comprises a metal printed circuit board (PCB) formed by laminating first and second sheet metal plates with an electric insulating layer interposed therebetween; and an LED chip mounted on the first sheet metal plate of the metal PCB, wherein the first sheet metal plate has electrode patterns and leads respectively extending from the electrode patterns.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.12/058,417 filed on Mar. 28, 2008, and claims priority to Korean PatentApplication No. 10-2007-0032018, filed Mar. 30, 2007, which are allhereby incorporated by reference for all purposes as if fully set forthherein.

FIELD OF THE INVENTION

The present invention relates to a light emitting diode (LED) package,and more particularly, to an LED package with a metal PCB.

BACKGROUND OF THE INVENTION

In general, an LED is an element in which electrons and holes arecombined in a P-N semiconductor junction structure by application ofcurrent thereby emitting certain light. The LED is typically formed tohave a package structure, in which an LED chip is mounted, and isfrequently referred to as an “LED package.” Such an LED package isgenerally mounted on a printed circuit board (PCB) and receives currentapplied from electrodes formed on the PCB to thereby emit light.

In an LED package, heat generated from an LED chip has a directinfluence on the light emitting performance and life span of the LEDpackage. The reason is that when heat generated from the LED chipremains for a long period of time, dislocation and mismatch occur in acrystal structure of the LED chip. Moreover, a high power LED packagehas been recently developed. Since the high power LED package isoperated by high-voltage power and a large amount of heat is generatedin an LED chip due to the high voltage, a separate device foreffectively dissipating the generated heat is required.

Therefore, there has been developed a conventional LED package forenhancing heat dissipation performance using a metal printed circuitboard (metal PCB) in which an insulating layer and a metal pattern layerare sequentially formed on an aluminum base. For example, such aconventional LED package is fabricated in such a manner that a hole cupis formed in the aluminum base so that a portion of the aluminum base isexposed upward by a groove machining process such as cutting, an LEDchip adheres to the hole cup, and then the LED chip and the metalpattern layer are connected to each other through a conductive wire.

However, the conventional LED package is difficult to be fabricated intoa compact structure due to a large thickness of the aluminum base, anddoes not have a lead structure for electrically connecting the LED chipto external electrodes. For this reason, it may be difficult to mountthe conventional LED package on a typically used PCB. This means thatthe conventional LED package is less compatible with a conventionalelectronic device or is illumination device. Since current LED packagemanufacturers mostly have equipments suitable for fabricating LEDpackages with a lead structure, the conventional LED package limits theuse of the existent equipments as described above. For this reason, theconventional LED package is also uneconomical.

Additionally, in the conventional LED package, since the hole cup isformed by a groove machining process such as a cutting process, themounting surface of an LED chip is uneven due to the groove machiningprocess, which causes a die attaching process of an LED chip to bedifficult. In addition, the die-attached LED chip may be easily damageddue to thermal and mechanical impact.

An object of the present invention is to provide an LED package having ametal PCB, which has a superior heat dissipation property and a compactstructure, does not largely restrict use of conventional equipments, andis compatible with an electronic device or illumination device currentlyused widely.

An LED package according to an aspect of the present invention comprisesa metal printed circuit board (PCB) formed by laminating first andsecond sheet metal plates with an electric insulating layer interposedtherebetween; and an LED chip mounted on the first sheet metal plate ofthe metal PCB, wherein the first sheet metal plate has electrodepatterns and leads respectively extending from the electrode patterns.

At this time, each of the leads is preferably formed by bending aportion of the first sheet metal plate extending in an outer sidedirection from the metal PCB. More preferably, each of the leads has anenlarged contact area with an external electrode through two-stepbending of the portion of the first sheet metal plate. Accordingly, eachlead can have an enlarged contact area with an external electrode.

Alternatively, each of the leads may comprises a terminal pattern formedby patterning the second sheet metal plate in correspondence to theelectrode pattern; and a via conductive portion passing through themetal PCB to connect the electrode pattern and the terminal pattern.

According to preferred embodiments of the present invention, the firstand second sheet metal plates may be made of copper or copper alloy. TheLED package may further comprise a molding member formed on the firstsheet metal plate to cover the LED chip. The LED package may furthercomprise a hole cup formed around the LED chip to adjust a directionalangle of light emitted from the LED chip. The hole cup may be formed ofresin, metal, ceramic or a composite thereof. The hole cup may be madeof an FR4 material. Further, the hole cup may include an insulatingplate and a metal reflective plate, each of which has an opening, andwhich are sequentially formed on the first sheet metal plate. Inaddition, the metal reflective plate may be made of aluminum.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing an LED package according to anembodiment of the present invention;

FIG. 2 is a sectional view of the LED package shown in FIG. 1;

FIG. 3 is a view illustrating an example of manufacturing a plurality ofLED packages having one large metal PCB as a base; and

FIG. 4 is a sectional view of an LED package according to anotherembodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, preferred embodiments of the present invention will bedescribed in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view showing an LED package according to anembodiment of the present invention, and FIG. 2 is a sectional view ofthe LED package shown in FIG. 1.

As shown in FIGS. 1 and 2, the LED package 1 of this embodimentcomprises a metal PCB 10, an LED chip 2 mounted on the metal PCB 10, andthe like. A transparent molding member 31 for protecting the LED chip 2is formed on the metal PCB 10 in a generally hemispherical shape. Themolding member 31 further includes an extension portion 32 extendingintegrally with the molding member 31 to cover portions of top and sidesurfaces of the metal PCB 10, and the extension portion 32 can protectnot only the LED chip 2 but also the metal PCB 10 from the outside.

The metal PCB 10 of this embodiment comprises first and second sheetmetal plates 16 and 12 and an insulating layer 14 interposed between thesheet metal plates 16 and 12, wherein the first and second sheet metalplates 16 and 12 are laminated with the insulating layer 14 interposedtherebetween. The second sheet metal plate 12 is made of copper orcopper alloy to form a base of the metal PCB 10, and the first sheetmetal plate 16 is made of copper or copper alloy to be electricallyinsulated from the second sheet metal plate 12 by the insulating layer14.

The first sheet metal plate 16 comprises a first electrode pattern 162a, to which the LED chip 2 adheres, and a second electrode pattern 162 bpatterned to be spaced apart from the first electrode pattern 162 a. TheLED chip 2 on the first electrode pattern 162 a is electricallyconnected to the second electrode pattern 162 b by a bonding wire W. Atthis time, the insulating layer 14 has an electrically insulatingproperty. For the purpose of smooth dissipation of heat generated fromthe LED chip 2, the insulating layer 14 is preferably formed of amaterial with excellent thermal conductivity.

According to the embodiment of the present invention, the first sheetmetal plate 16 further includes leads 164 a and 164 b extending in anouter side direction of the metal PCB 10. The leads 164 a and 164 b areportions connected to external electrodes on an external PCB (not shown)on which the LED package 1 is mounted. Through two-step bending, each ofthe leads 164 a and 164 b is directed downward and has a broad contactarea with an external electrode (not shown). That is, each of the leads164 a and 164 b is bent to be directed downward through a first bendingprocess and to fold up through a second bending process, thereby havingan end with a thickness greater than the original thickness of the firstsheet metal plate 16.

The LED package 1 shown in FIGS. 1 and 2 is of a top view type in whicha package mounting surface and a light emitting surface are positionedto be opposite to each other due to the bending positions and directionsof the leads 164 a and 164 b. However, it may be considered that thebending positions and directions of the leads 164 a and 164 b aredifferent from each other whereby the package mounting surface and thelight emitting surface are perpendicular to each other. As such, theconfiguration in which the package mounting surface and the lightemitting surface are perpendicular to each other is suitable forimplementing an LED package typically called a side view type LEDpackage.

In addition, the LED package 1 of this embodiment further includes ahole cup 20 for obtaining a desired directional angle of light, i.e.,for adjusting the directional angle of light emitted from the LED chip2. The hole cup 20 includes an opening, in which a portion of themolding member 31 is filled, and serves to reflect light within adesired directional angle range by surrounding a circumference of theLED chip 2 on the first sheet metal plate 16. Since the hole cup 20 isdirectly laminated on the first sheet metal plate 16 of the metal PCB10, it is unnecessary to form the hole cup 20 by machining a groove inthe metal PCB 10. Accordingly, the chip mounting surface of the metalPCB 10 is formed to be flat unlike the prior art.

According to the embodiment of the present invention, the hole cup 20may be used by forming an opening in a plate-shaped member and formed ofa resin, metal, ceramic or a composite thereof. As an example, the holecup 20 may be formed of a material such as FR4. The FR4 is Epoxy ResinBonded Glass Fiber (ERBGF) reinforced by combining glass fiber withepoxy, which has excellent strength and light reflexibility, and isgenerally used as a raw material of PCBs.

As another example, the hole cup 20 may be formed in such manner that aninsulating plate 21 and a metal reflective plate 22, which arerespectively formed with openings, adhere to each other as shown in theenlarged view of FIG. 2. At this time, the insulating plate 21 serves tocause the metal reflective plate 22 and the first sheet metal plate 16positioned under the insulating plate 21 to be electrically insulated.Preferably, the metal reflective plate 22 is made of an aluminummaterial.

According to the embodiment of the present invention, the aforementionedmetal PCB 10 is a unit metal PCB cut and separated from a large metalPCB 10′ (hereinafter, referred to as a “laminated raw material”) shownin FIG. 3, and a plurality of the LED packages 1, each of which has themetal PCB 10, are previously formed using the laminated raw material 10′as a base, as shown in FIG. 3. The laminated raw material 10′ is alaminate of the first sheet metal plate 16, the insulating layer 14 andthe second sheet metal plate 12, which are patterned and machined tohave a predetermined shape. The plurality of LED packages 1 aresupported on the laminated raw material 10′ through the leads 164 a and164 b extending from the first sheet metal plate 16 and supportingportions 102′ of the respective layers. The supporting portions 102′ andthe leads 164 a and 164 b are cut, and the leads 164 a and 164 b arebent as described above, thereby completing the unit LED packages 1 eachhaving the configuration shown in FIGS. 1 and 2.

FIG. 4 is a sectional view of an LED package 1 according to anotherembodiment of the present invention. The LED package 1 of thisembodiment has a configuration substantially equal to the aforementionedembodiment, except the configuration of leads extending from theelectrode patterns 162 a and 162 b of the first sheet metal plate 16.Hereinafter, the configuration of the leads different from those of theprevious embodiment will be mainly described.

As shown in FIG. 4, the leads of this embodiment include terminalpatterns 121 and 122 formed by patterning a second sheet metal plate 12in correspondence to electrode patterns 162 a and 162 b of a first sheetmetal plate 16, and via conductive portions 165 a and 165 b passingthrough a metal PCB 10 to connect the electrode patterns 162 a and 162 band the terminal patterns 121 and 122. At this time, the via conductiveportions 165 a and 165 b may be formed by previously forming openingsbored through the metal PCB 10 and then filling the openings with ametal made of the same material as the first sheet metal plate 16 and/orthe second sheet metal plate 12, for example, by a plating method or thelike.

As described above, an LED package according to the present inventionhas a sufficient heat dissipation property and a compact structure, andincludes leads connected to external electrodes while using a metal PCBand having a structure approximately equal to a general LED package,thereby having excellent compatibility with a conventional electronicdevice or illumination device. Further, the LED package according to thepresent invention and a general LED package without a metal PCB aremanufactured through a considerably similar process. Thus, there is aneconomical advantage in that many equipments possessed by current LEDpackage manufacturers can be used in manufacturing the LED packageaccording to the present invention as they are. Furthermore, anadditional groove machining process is not required to form a hole cupin which an LED chip is positioned, so that LED package according to thepresent invention has a flat chip mounting surface. Accordingly, a dieattaching process of the LED chip can be performed more easily ascompared with a conventional metal PCB-type LED package, and the dieattached LED chip is strong against thermal and mechanical impact.

Although the present invention have been described with a specifiedembodiment, it will be apparent to those skilled in the art that variousmodifications, changes and variations can be made thereto within thescope of the present invention and the appended claims. Therefore, theaforementioned descriptions and the accompanying drawings should beconstrued as not limiting the technical spirit of the present inventionbut illustrating the present invention.

1. A light emitting diode package, comprising: a first metal platecomprising a first electrode and a second electrode spaced apart fromeach other; a second metal plate comprising a first terminal and asecond terminal spaced apart from each other; an insulating layerinterposed between the first metal plate and the second metal plate, theinsulating layer having a first via hole and a second via hole formedthrough itself; a first conductive portion filled in the first via holeto connect between the first electrode and the first terminal; a secondconductive portion filled in the second via hole to connect between thesecond electrode and the second terminal; a hole cup layer disposed onthe first metal plate, the hole cup layer comprising an opening thatexposes the first electrode and second electrode; a light emitting chippositioned in the opening; and a molding member disposed on the hole cuplayer to cover the opening.
 2. The light emitting diode package of claim1, wherein the hole cup layer comprises an insulating plate disposeddirectly on the first metal plate and a reflective plate disposeddirectly on the insulating plate.
 3. The light emitting diode package ofclaim 1, wherein the molding member comprises an extension portion thatcovers an upper surface of the hole cup layer.
 4. The light emittingdiode package of claim 3 wherein the molding member comprises a convexportion at the position corresponding to the opening.
 5. The lightemitting diode package of claim 1, wherein the molding member comprisesan extension portion that covers an upper surface of the hole cup layerand sides of the hole cup layer, the first metal plate, the insulatinglayer and the second metal plate.
 6. The light emitting diode package ofclaim 2 wherein the insulating plate comprises resin, ceramic or FR4material.
 7. The light emitting diode package of claim 2, wherein thereflective plate comprises metal.
 8. The light emitting diode package ofclaim 2, wherein the reflective plate comprises Aluminum.
 9. The lightemitting diode package of claim 1, wherein the first metal plate and thesecond metal plate each comprises copper or copper alloy.